Skip to main navigation Skip to search Skip to main content

Highly promoted hydrogen production enabled by interfacial P–N chemical bonds in copper phosphosulfide Z-scheme composite

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

Transition metal phosphosulfides (TMPSs) have shown great potential as efficient catalysts toward hydrogen evolution reaction (HER). To further understand and promote the catalytic activity at the phosphosulfide (PS) structures, the multifunctional role of TMPS needs to be explored. Herein, we report copper phosphosulfide (Cu3P|S) coupled with graphene-like C3N4 (GL-C3N4) as an excellent HER photocatalyst with a hydrogen production rate of 8.78 mmol g−1 h−1 (20.22 mmol g−1 h−1 with 0.5 wt.% Pt). Systematic investigations on the interaction between Cu3P|S and GL-C3N4 unveil that such impressive photocatalytic activity arises from the interfacial P–N chemical bond that constructs a Z-scheme heterostructure. Time-resolved photoluminescence analysis indicates a considerably suppressed recombination rate of photoexcited charge carriers at the interface, which facilitates electron transfer and enhances the reducibility of electrons in the conduction band of Cu3P|S. This work provides new design strategies for employing TMPSs as photocatalysts for highly efficient HER and other photoreduction reactions.

Original languageEnglish
Article number119624
JournalApplied Catalysis B: Environmental
Volume283
DOIs
Publication statusPublished - Apr 2021

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

  1. SDG 7 - Affordable and Clean Energy
    SDG 7 Affordable and Clean Energy

Keywords

  • Copper phosphosulfide
  • Hydrogen evolution reaction
  • Interfacial charge transfer
  • Photocatalysis
  • P–N bond

ASJC Scopus subject areas

  • Catalysis
  • General Environmental Science
  • Process Chemistry and Technology

Fingerprint

Dive into the research topics of 'Highly promoted hydrogen production enabled by interfacial P–N chemical bonds in copper phosphosulfide Z-scheme composite'. Together they form a unique fingerprint.

Cite this