TY - GEN
T1 - Highly Area-Efficient Low-Power SRAM Cell with 2 Transistors and 2 Resistors
AU - Li, Jiayi
AU - Zhou, Peng
AU - Li, Jingyu
AU - DIng, Yi
AU - Liu, Chunsen
AU - Hou, Xiang
AU - Chen, Huawei
AU - Xiong, Yan
AU - Zhang, David Wei
AU - Chai, Yang
PY - 2019/12
Y1 - 2019/12
N2 - We demonstrate a 2-transistor/2-resistor (2T2R) static-random-access-memory (SRAM) cell with high read/write stability composed of two-surface-channel (TSC) transistors, using two-dimensional (2D) layered MoS2. The 2T2R SRAM cell consists of fewer transistors than a conventional 6-transistor (6T) SRAM cell by fully utilizing high-area-efficiency structure of TSC MoS2 transistors. We verify the channel material thickness-dependent logic behavior between AND and OR. Simultaneously, the 2T2R SRAM exhibits stable read and write operations with a 32.6 % read normalized noise margin (NM) and a 50.2 % write normalized NM under optimal resistance and supply voltage conditions. The read and write power of the memory devices are 0.035 μW and 0.036 μW, respectively, indicating a promising application in low-power electronics and highly area-efficient chips.
AB - We demonstrate a 2-transistor/2-resistor (2T2R) static-random-access-memory (SRAM) cell with high read/write stability composed of two-surface-channel (TSC) transistors, using two-dimensional (2D) layered MoS2. The 2T2R SRAM cell consists of fewer transistors than a conventional 6-transistor (6T) SRAM cell by fully utilizing high-area-efficiency structure of TSC MoS2 transistors. We verify the channel material thickness-dependent logic behavior between AND and OR. Simultaneously, the 2T2R SRAM exhibits stable read and write operations with a 32.6 % read normalized noise margin (NM) and a 50.2 % write normalized NM under optimal resistance and supply voltage conditions. The read and write power of the memory devices are 0.035 μW and 0.036 μW, respectively, indicating a promising application in low-power electronics and highly area-efficient chips.
UR - http://www.scopus.com/inward/record.url?scp=85081052962&partnerID=8YFLogxK
U2 - 10.1109/IEDM19573.2019.8993520
DO - 10.1109/IEDM19573.2019.8993520
M3 - Conference article published in proceeding or book
AN - SCOPUS:85081052962
T3 - Technical Digest - International Electron Devices Meeting, IEDM
BT - 2019 IEEE International Electron Devices Meeting, IEDM 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 65th Annual IEEE International Electron Devices Meeting, IEDM 2019
Y2 - 7 December 2019 through 11 December 2019
ER -