High resolution imaging of bio-molecular binding studies using a widefield surface plasmon microscope

M. Mahadi Abdul Jamil, M. Youseffi, P. C. Twigg, S. T. Britland, S. Liu, C. W. See, J. Zhang, Michael Geoffrey Somekh, M. C.T. Denyer

Research output: Journal article publicationJournal articleAcademic researchpeer-review

14 Citations (Scopus)


Surface plasmon microscopes are mostly built around the prism based Kretschmann configuration. In these systems, an image of a sample can be obtained in terms of an intensity map, where the intensity of the image is dependent on the coupling of the light into the surface plasmons. Unfortunately the lateral resolution of these systems relies on the ability of plasmons to propagate along the metallised layer and is usually limited to a few microns unless special measures are taken. The widefield surface plasmon microscope (WSPR), used here enables surface plasmon imaging at significantly higher lateral resolutions than prism based systems. In this study we demonstrate the functionality of the WSPR by imaging a sequence of binding events between micro-patterned extracellular matrix proteins and their specific antibodies. Using the WSPR system a change in contrast was observed with each binding event. Images produced via the WSPR system were analyzed and compared qualitatively and quantitatively. Consequently, we confirm that the WSPR microscope described here can be used to study sequential monomolecular layer binding events on a micron scale. These results have significant implications in the development of new micron scale bioassays.
Original languageEnglish
Pages (from-to)566-574
Number of pages9
JournalSensors and Actuators, B: Chemical
Issue number2
Publication statusPublished - 22 Feb 2008
Externally publishedYes


  • Bio-molecular interaction
  • High resolution
  • Micro-contact printing
  • Surface plasmons

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Instrumentation
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Electrical and Electronic Engineering
  • Materials Chemistry

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