Keyphrases
High Performance
100%
Silica Coating
100%
Epoxy
100%
Electronic Packaging
100%
Ag Nanowires (AgNWs)
100%
Silver Nanowires
100%
Nanowire Composite
100%
Underfill Material
100%
Materials for Electronics
100%
Silica
33%
Nanolayers
22%
Sol-gel Method
11%
Epoxy Resin
11%
Dielectric Properties
11%
Nanowires
11%
Thermal Conductivity
11%
Viscosity
11%
High Electrical Conductivity
11%
Core-shell Structure
11%
High Aspect Ratio
11%
Nanostructured Materials
11%
High Thermal Conductivity
11%
Electrical Insulation
11%
Filler Loading
11%
Interfacial Interaction
11%
Electrically Conductive Network
11%
Underfill Process
11%
SiO2 Composite
11%
SiO2 Nanotubes
11%
Material Science
Composite Material
100%
Nanowires
100%
Silver
100%
Silicon Dioxide
100%
Thermal Conductivity
40%
Nanostructured Material
20%
Sol-Gel
20%
Epoxy
20%
Dielectric Property
20%
Electrical Conductivity
20%