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High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging

  • Chao Chen
  • , Yang Xue
  • , Xiongwei Li
  • , Yingfeng Wen
  • , Jinwei Liu
  • , Zhigang Xue
  • , Dean Shi
  • , Xingping Zhou
  • , Xiaolin Xie
  • , Yiu Wing Mai

Research output: Journal article publication › Journal article › Academic research › peer-review

168   Link opens in a new tab Citations (Scopus)

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Material Science