TY - JOUR
T1 - High-performance epoxy/binary spherical alumina composite as underfill material for electronic packaging
AU - Chen, Chao
AU - Xue, Yang
AU - Li, Xiongwei
AU - Wen, Yingfeng
AU - Liu, Jinwei
AU - Xue, Zhigang
AU - Shi, Dean
AU - Zhou, Xingping
AU - Xie, Xiaolin
AU - Mai, Yiu Wing
N1 - Publisher Copyright:
© 2018 Elsevier Ltd
PY - 2019/3
Y1 - 2019/3
N2 - In this study, epoxy (EP)/binary spherical alumina (S-Al2O3) composites with a high loading of 50 vol% were fabricated by incorporating different sizes of S-Al2O3 into EP to increase the thermal conductivity and yet retain the flowability of the composites. Notably, a distinctly reduced viscosity (21.8 Pa·s) and a highly increased thermal conductivity (1.364 W/m·K) were achieved by a binary S-Al2O3 mixture with 80% 30 μm and 20% 5 μm alumina that would have a theoretical maximum packing volume, thus permitting larger available free volume for the motion of particles and hence reducing the friction between them. Also, these EP/S-Al2O3 binary composites possessed superior electrical insulation, high thermal stability, significantly reduced thermal expansion coefficient and good mechanical properties. These combined desirable properties indicate that binary S-Al2O3 mixtures with an optimized size distribution and maximum packing volume are best candidates to develop high-performance epoxy-based underfill materials which would improve the flip-chip reliability.
AB - In this study, epoxy (EP)/binary spherical alumina (S-Al2O3) composites with a high loading of 50 vol% were fabricated by incorporating different sizes of S-Al2O3 into EP to increase the thermal conductivity and yet retain the flowability of the composites. Notably, a distinctly reduced viscosity (21.8 Pa·s) and a highly increased thermal conductivity (1.364 W/m·K) were achieved by a binary S-Al2O3 mixture with 80% 30 μm and 20% 5 μm alumina that would have a theoretical maximum packing volume, thus permitting larger available free volume for the motion of particles and hence reducing the friction between them. Also, these EP/S-Al2O3 binary composites possessed superior electrical insulation, high thermal stability, significantly reduced thermal expansion coefficient and good mechanical properties. These combined desirable properties indicate that binary S-Al2O3 mixtures with an optimized size distribution and maximum packing volume are best candidates to develop high-performance epoxy-based underfill materials which would improve the flip-chip reliability.
KW - A. Polymer-matrix composites
KW - B. Mechanical properties
KW - B. Thermal properties
KW - D. Rheology
UR - https://www.scopus.com/pages/publications/85059066911
U2 - 10.1016/j.compositesa.2018.12.019
DO - 10.1016/j.compositesa.2018.12.019
M3 - Journal article
AN - SCOPUS:85059066911
SN - 1359-835X
VL - 118
SP - 67
EP - 74
JO - Composites Part A: Applied Science and Manufacturing
JF - Composites Part A: Applied Science and Manufacturing
ER -