High frequency RF microswitches using MEMS integrated fabrication process

A. Q. Liu, G. I. Ng, Y. L. Lam, S. T. Chew, S. K. Ting

Research output: Journal article publicationConference articleAcademic researchpeer-review

Abstract

Both electrical and mechanical models, exemplified with a micromachined capacitive switch with simple bridge structure, accurately describing its electrical and mechanical characteristics are described in this paper. The electrical model is represented as a RLC circuit, while the mechanical model is represented as a fixed-fixed beam. The advantage of these models is that it is possible to pre-determine various characteristics, such as the switching time of micromachined capacitive switches, during the design stage. These models can be used to accurately design micromachined capacitive switches for microwave applications. An illustrated fabrication process is also discussed.

Original languageEnglish
Pages (from-to)34-42
Number of pages9
JournalProceedings of SPIE - The International Society for Optical Engineering
Volume4230
DOIs
Publication statusPublished - Nov 2000
Externally publishedYes
EventMicromachining and Microfabrication - Singapure, Singapore
Duration: 28 Nov 200030 Nov 2000

Keywords

  • Capacitive switch
  • MEMS
  • Microwave
  • RF MEMS

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering

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