High electromigration-resistant copper/carbon nanotube composite for interconnect application

Yang Chai

doi:10.1109/IEDM.2008.4796764

High electromigration-resistant copper/carbon nanotube composite for interconnect application

Yang Chai

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

22 Citations (Scopus)

Abstract

We demonstrated a Cu/CNT composite material for interconnect application. The electromigration (EM) properties of Cu/CNT composite via and line were investigated using Kelvin and Blech test structures respectively. Our results showed that the EM lifetime of the Cu/CNT composite is more than 5 times longer than Cu.

Original language	English
Title of host publication	2008 IEEE International Electron Devices Meeting, IEDM 2008
DOIs	https://doi.org/10.1109/IEDM.2008.4796764
Publication status	Published - 1 Dec 2008
Externally published	Yes
Event	2008 IEEE International Electron Devices Meeting, IEDM 2008 - San Francisco, CA, United States Duration: 15 Dec 2008 → 17 Dec 2008

Conference

Conference	2008 IEEE International Electron Devices Meeting, IEDM 2008
Country/Territory	United States
City	San Francisco, CA
Period	15/12/08 → 17/12/08

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics
Materials Chemistry
Electrical and Electronic Engineering

More information

10.1109/IEDM.2008.4796764

Cite this

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title = "High electromigration-resistant copper/carbon nanotube composite for interconnect application",

abstract = "We demonstrated a Cu/CNT composite material for interconnect application. The electromigration (EM) properties of Cu/CNT composite via and line were investigated using Kelvin and Blech test structures respectively. Our results showed that the EM lifetime of the Cu/CNT composite is more than 5 times longer than Cu.",

author = "Yang Chai",

year = "2008",

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AU - Chai, Yang

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AB - We demonstrated a Cu/CNT composite material for interconnect application. The electromigration (EM) properties of Cu/CNT composite via and line were investigated using Kelvin and Blech test structures respectively. Our results showed that the EM lifetime of the Cu/CNT composite is more than 5 times longer than Cu.

UR - https://www.scopus.com/pages/publications/64549150487

U2 - 10.1109/IEDM.2008.4796764

DO - 10.1109/IEDM.2008.4796764

M3 - Conference article published in proceeding or book

SN - 9781424423781

BT - 2008 IEEE International Electron Devices Meeting, IEDM 2008

T2 - 2008 IEEE International Electron Devices Meeting, IEDM 2008

Y2 - 15 December 2008 through 17 December 2008

ER -

High electromigration-resistant copper/carbon nanotube composite for interconnect application

Abstract

Conference

ASJC Scopus subject areas

More information

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