High aspect-ratio blind microvia formation in printed circuit board by laser-assisted seeding (LAS) mechanism

E.S.W. Leung; Kam Chuen Yung

High aspect-ratio blind microvia formation in printed circuit board by laser-assisted seeding (LAS) mechanism

E.S.W. Leung
, Kam Chuen Yung

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Pages	393-404
Number of pages	12
Publication status	Published - 2002
Event	International Conference on Quality and Reliability - Duration: 1 Jan 2002 → …

Conference

Conference	International Conference on Quality and Reliability
Period	1/01/02 → …

Cite this

@conference{b0087d4f8556496ea017739ff1f3f946,

title = "High aspect-ratio blind microvia formation in printed circuit board by laser-assisted seeding (LAS) mechanism",

author = "E.S.W. Leung and Yung, \{Kam Chuen\}",

year = "2002",

language = "English",

pages = "393--404",

note = "International Conference on Quality and Reliability ; Conference date: 01-01-2002",

}

High aspect-ratio blind microvia formation in printed circuit board by laser-assisted seeding (LAS) mechanism. / Leung, E.S.W.; Yung, Kam Chuen.
2002. 393-404 Paper presented at International Conference on Quality and Reliability.

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review