Global collaborative electronic packaging education

Pin Tong, D. C.C. Lam, M. M.F. Yuen, J. K. Kim, R. S.W. Lee, S. H.K. Lee, Philip Ching Ho Chan

Research output: Journal article publicationConference articleAcademic researchpeer-review

Abstract

An account is given on a proposal to establish a global collaborative educational program at the MS level in electronics packaging in the School of Engineering at the Hong Kong University of Science and Technology (HKUST). The goal of the program is to educate skilled engineers, technical managers, and visionary leaders who can pull off the transition to the future for the electronics packaging industry. Curricula in this program include traditional engineering core courses and specialized electronic packaging courses.
Original languageEnglish
Pages (from-to)907-911
Number of pages5
JournalProceedings - Electronic Components and Technology Conference
Publication statusPublished - 1 Jan 1999
Externally publishedYes
EventProceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, United States
Duration: 1 Jun 19994 Jun 1999

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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