Global collaborative electronic packaging education

Pin Tong; D. C.C. Lam; M. M.F. Yuen; J. K. Kim; R. S.W. Lee; S. H.K. Lee; Philip Ching Ho Chan

Global collaborative electronic packaging education

Pin Tong, D. C.C. Lam, M. M.F. Yuen, J. K. Kim, R. S.W. Lee, S. H.K. Lee, Philip Ching Ho Chan

Research output: Journal article publication › Conference article › Academic research › peer-review

Abstract

An account is given on a proposal to establish a global collaborative educational program at the MS level in electronics packaging in the School of Engineering at the Hong Kong University of Science and Technology (HKUST). The goal of the program is to educate skilled engineers, technical managers, and visionary leaders who can pull off the transition to the future for the electronics packaging industry. Curricula in this program include traditional engineering core courses and specialized electronic packaging courses.

Original language	English
Pages (from-to)	907-911
Number of pages	5
Journal	Proceedings - Electronic Components and Technology Conference
Publication status	Published - 1 Jan 1999
Externally published	Yes
Event	Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) - San Diego, CA, United States Duration: 1 Jun 1999 → 4 Jun 1999

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

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title = "Global collaborative electronic packaging education",

abstract = "An account is given on a proposal to establish a global collaborative educational program at the MS level in electronics packaging in the School of Engineering at the Hong Kong University of Science and Technology (HKUST). The goal of the program is to educate skilled engineers, technical managers, and visionary leaders who can pull off the transition to the future for the electronics packaging industry. Curricula in this program include traditional engineering core courses and specialized electronic packaging courses.",

author = "Pin Tong and Lam, {D. C.C.} and Yuen, {M. M.F.} and Kim, {J. K.} and Lee, {R. S.W.} and Lee, {S. H.K.} and Chan, {Philip Ching Ho}",

year = "1999",

month = jan,

day = "1",

language = "English",

pages = "907--911",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "IEEE",

note = "Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC) ; Conference date: 01-06-1999 Through 04-06-1999",

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TY - JOUR

T1 - Global collaborative electronic packaging education

AU - Tong, Pin

AU - Lam, D. C.C.

AU - Yuen, M. M.F.

AU - Kim, J. K.

AU - Lee, R. S.W.

AU - Lee, S. H.K.

AU - Chan, Philip Ching Ho

PY - 1999/1/1

Y1 - 1999/1/1

N2 - An account is given on a proposal to establish a global collaborative educational program at the MS level in electronics packaging in the School of Engineering at the Hong Kong University of Science and Technology (HKUST). The goal of the program is to educate skilled engineers, technical managers, and visionary leaders who can pull off the transition to the future for the electronics packaging industry. Curricula in this program include traditional engineering core courses and specialized electronic packaging courses.

AB - An account is given on a proposal to establish a global collaborative educational program at the MS level in electronics packaging in the School of Engineering at the Hong Kong University of Science and Technology (HKUST). The goal of the program is to educate skilled engineers, technical managers, and visionary leaders who can pull off the transition to the future for the electronics packaging industry. Curricula in this program include traditional engineering core courses and specialized electronic packaging courses.

UR - http://www.scopus.com/inward/record.url?scp=0032630112&partnerID=8YFLogxK

M3 - Conference article

SN - 0569-5503

SP - 907

EP - 911

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - Proceedings of the 1999 49th Electronic Components and Technology Conference (ECTC)

Y2 - 1 June 1999 through 4 June 1999

ER -

Global collaborative electronic packaging education

Abstract

ASJC Scopus subject areas

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