Abstract
This paper presents a multidisciplinary approach to the analysis of the fluctuation of cutting forces in the diamond turning of crystalline materials. The analysis is based on a microplasticity model for shear angle prediction and a cutting force model incorporating a friction variable which is estimated from the power spectrum analysis. The results reveal that the pattern of periodic fluctuation of the microcutting forces is not only due to the crystallographic orientation of the materials being cut but also to the friction between the chip and the tool face. The frictional effect is found to cause a change in the pattern and the periodicity of the fluctuation of the cutting force. The power spectrum predicted from the cutting force model incorporates a friction variable which can be chosen to match the experimental power spectrum, thus providing a new way to assess the frictional condition, and can be used as a diagnostic tool to monitor the tool wear and cutting conditions during diamond turning.
| Original language | English |
|---|---|
| Pages (from-to) | 615-631 |
| Number of pages | 17 |
| Journal | Proceedings of the Institution of Mechanical Engineers, Part B: Journal of Engineering Manufacture |
| Volume | 217 |
| Issue number | 5 |
| DOIs | |
| Publication status | Published - 23 Jun 2003 |
Keywords
- Crystallographic orientation
- Friction
- Microplasticity
- Single-point diamond turning
- Spectrum analysis
ASJC Scopus subject areas
- Mechanical Engineering
- Industrial and Manufacturing Engineering