Fracture mechanics analysis on Smart-Cut® technology: Effects of stiffening wafer and defect interaction
- Bin Gu
- , Hong Yuan Liu
- , Yiu Wing Mai
- , Xi Qiao Feng
- , Shou Wen Yu
Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review
2
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(Scopus)