Forced convective air-cooling of simulated printed-circuit boards

W. C. Tam; Chun Wah Leung; S. D. Probert

doi:10.1016/0306-2619(93)90072-W

Forced convective air-cooling of simulated printed-circuit boards

W. C. Tam, Chun Wah Leung, S. D. Probert

Research output: Journal article publication › Journal article › Academic research › peer-review

10 Citations (Scopus)

Abstract

The considered assembly consisted of a simulated printed-circuit board (PCB), in this instance a horizontal, thermally insulting base with uniformly spaced rectangular copper bars-hereafter referred to as ribs, used to mimic the behaviour of electronic components-protruding upwards from the base. The assembly was mounted in a thermally well insulated, rectangular-sectioned duct, so that air could be sucked solely over the upper surface of the simulated PCB; the horizontal ribs were arranged to be orthogonal to the horizontal mean air-flow. Steady-state heat-transfer performance data, showing the influence of the geometry of the system, were measured. A non-dimensional correlation, which can be used by designers to predict the steady-state rate of heat transfer from such a PCB assembly to the air flow, is Nuc=1·4×10- Re9·88c for 8·5 × 102 ≤ Rec ≤ 3·5 × 104.

Original language	English
Pages (from-to)	197-214
Number of pages	18
Journal	Applied Energy
Volume	46
Issue number	3
DOIs	https://doi.org/10.1016/0306-2619(93)90072-W
Publication status	Published - 1 Jan 1993

ASJC Scopus subject areas

Civil and Structural Engineering
General Energy

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10.1016/0306-2619(93)90072-W

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title = "Forced convective air-cooling of simulated printed-circuit boards",

abstract = "The considered assembly consisted of a simulated printed-circuit board (PCB), in this instance a horizontal, thermally insulting base with uniformly spaced rectangular copper bars-hereafter referred to as ribs, used to mimic the behaviour of electronic components-protruding upwards from the base. The assembly was mounted in a thermally well insulated, rectangular-sectioned duct, so that air could be sucked solely over the upper surface of the simulated PCB; the horizontal ribs were arranged to be orthogonal to the horizontal mean air-flow. Steady-state heat-transfer performance data, showing the influence of the geometry of the system, were measured. A non-dimensional correlation, which can be used by designers to predict the steady-state rate of heat transfer from such a PCB assembly to the air flow, is Nuc=1·4×10- Re9·88c for 8·5 × 102 ≤ Rec ≤ 3·5 × 104.",

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AU - Leung, Chun Wah

AU - Probert, S. D.

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Y1 - 1993/1/1

N2 - The considered assembly consisted of a simulated printed-circuit board (PCB), in this instance a horizontal, thermally insulting base with uniformly spaced rectangular copper bars-hereafter referred to as ribs, used to mimic the behaviour of electronic components-protruding upwards from the base. The assembly was mounted in a thermally well insulated, rectangular-sectioned duct, so that air could be sucked solely over the upper surface of the simulated PCB; the horizontal ribs were arranged to be orthogonal to the horizontal mean air-flow. Steady-state heat-transfer performance data, showing the influence of the geometry of the system, were measured. A non-dimensional correlation, which can be used by designers to predict the steady-state rate of heat transfer from such a PCB assembly to the air flow, is Nuc=1·4×10- Re9·88c for 8·5 × 102 ≤ Rec ≤ 3·5 × 104.

AB - The considered assembly consisted of a simulated printed-circuit board (PCB), in this instance a horizontal, thermally insulting base with uniformly spaced rectangular copper bars-hereafter referred to as ribs, used to mimic the behaviour of electronic components-protruding upwards from the base. The assembly was mounted in a thermally well insulated, rectangular-sectioned duct, so that air could be sucked solely over the upper surface of the simulated PCB; the horizontal ribs were arranged to be orthogonal to the horizontal mean air-flow. Steady-state heat-transfer performance data, showing the influence of the geometry of the system, were measured. A non-dimensional correlation, which can be used by designers to predict the steady-state rate of heat transfer from such a PCB assembly to the air flow, is Nuc=1·4×10- Re9·88c for 8·5 × 102 ≤ Rec ≤ 3·5 × 104.

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Forced convective air-cooling of simulated printed-circuit boards

Abstract

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