Flip-chip based 3-D high-Q integrated inductors

Jing Feng Gong, Philip Ching Ho Chan

Research output: Journal article publicationConference articleAcademic researchpeer-review

Abstract

Solenoid type inductors have been realized using electroplating and flip chip packaging technology. The inductors were embedded in the package and are more reliable than the inductors built by MEMS techniques. The electromagnetic simulations have been performed to predict the inductors performances. The fabricated inductors achieved inductance ranging from InH to 2.5nH. The maximum Q factor is well above 15 even when the lossy silicon is at the both sides of the inductor.
Original languageEnglish
Pages (from-to)1095-1100
Number of pages6
JournalProceedings - Electronic Components and Technology Conference
Volume1
Publication statusPublished - 27 Dec 2004
Externally publishedYes
Event2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States
Duration: 1 Jun 20044 Jun 2004

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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