Flip-chip based 3-D high-Q integrated inductors

Jing Feng Gong; Philip Ching Ho Chan

Flip-chip based 3-D high-Q integrated inductors

Jing Feng Gong, Philip Ching Ho Chan

Research output: Journal article publication › Conference article › Academic research › peer-review

Abstract

Solenoid type inductors have been realized using electroplating and flip chip packaging technology. The inductors were embedded in the package and are more reliable than the inductors built by MEMS techniques. The electromagnetic simulations have been performed to predict the inductors performances. The fabricated inductors achieved inductance ranging from InH to 2.5nH. The maximum Q factor is well above 15 even when the lossy silicon is at the both sides of the inductor.

Original language	English
Pages (from-to)	1095-1100
Number of pages	6
Journal	Proceedings - Electronic Components and Technology Conference
Volume	1
Publication status	Published - 27 Dec 2004
Externally published	Yes
Event	2004 Proceedings - 54th Electronic Components and Technology Conference - Las Vegas, NV, United States Duration: 1 Jun 2004 → 4 Jun 2004

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

Cite this

@article{1591bc8fd12d4331b8844b09155d68ba,

title = "Flip-chip based 3-D high-Q integrated inductors",

abstract = "Solenoid type inductors have been realized using electroplating and flip chip packaging technology. The inductors were embedded in the package and are more reliable than the inductors built by MEMS techniques. The electromagnetic simulations have been performed to predict the inductors performances. The fabricated inductors achieved inductance ranging from InH to 2.5nH. The maximum Q factor is well above 15 even when the lossy silicon is at the both sides of the inductor.",

author = "Gong, {Jing Feng} and Chan, {Philip Ching Ho}",

year = "2004",

month = dec,

day = "27",

language = "English",

volume = "1",

pages = "1095--1100",

journal = "Proceedings - Electronic Components and Technology Conference",

issn = "0569-5503",

publisher = "IEEE",

note = "2004 Proceedings - 54th Electronic Components and Technology Conference ; Conference date: 01-06-2004 Through 04-06-2004",

}

TY - JOUR

T1 - Flip-chip based 3-D high-Q integrated inductors

AU - Gong, Jing Feng

AU - Chan, Philip Ching Ho

PY - 2004/12/27

Y1 - 2004/12/27

N2 - Solenoid type inductors have been realized using electroplating and flip chip packaging technology. The inductors were embedded in the package and are more reliable than the inductors built by MEMS techniques. The electromagnetic simulations have been performed to predict the inductors performances. The fabricated inductors achieved inductance ranging from InH to 2.5nH. The maximum Q factor is well above 15 even when the lossy silicon is at the both sides of the inductor.

AB - Solenoid type inductors have been realized using electroplating and flip chip packaging technology. The inductors were embedded in the package and are more reliable than the inductors built by MEMS techniques. The electromagnetic simulations have been performed to predict the inductors performances. The fabricated inductors achieved inductance ranging from InH to 2.5nH. The maximum Q factor is well above 15 even when the lossy silicon is at the both sides of the inductor.

UR - http://www.scopus.com/inward/record.url?scp=10444282801&partnerID=8YFLogxK

M3 - Conference article

SN - 0569-5503

VL - 1

SP - 1095

EP - 1100

JO - Proceedings - Electronic Components and Technology Conference

JF - Proceedings - Electronic Components and Technology Conference

T2 - 2004 Proceedings - 54th Electronic Components and Technology Conference

Y2 - 1 June 2004 through 4 June 2004

ER -

Flip-chip based 3-D high-Q integrated inductors

Abstract

ASJC Scopus subject areas

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