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Fast growth of centimeter-scale single-crystal copper foils with high-index planes by the edge-incision effect: 2d Materials

  • L. Li
  • , T. Ma
  • , W. Yu
  • , M. L. Zhu
  • , J. Li
  • , Z. Chen
  • , H. H. Li
  • , M. Zhao
  • , J. H. Teng
  • , B. B. Tian
  • , C. L. Su
  • , K. P. Loh

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

Single-crystal copper substrates have gained importance for the preparation of high-quality graphene and hexagonal boron nitride monolayer films by chemical vapor deposition (CVD). Especially, large-scale single-crystal copper foils with high-index planes are synthesized recently and attract great interests. However, the current synthesis methods of single-crystal copper foils and films are energy and time-consuming. Here, we show a rapid and efficient approach for the preparation of centimeter-scale single-crystal copper foils by making small incisions at the edges of polycrystalline copper foils before high-temperature annealing. 1.5 cm x 4 cm pieces of grain-boundary-free copper foils can be prepared by annealing at 1080 degrees C for 60 min. The annealed copper foil manifests a single high-index plane and is grain-boundary-free over the whole area. We also show that CVD of graphene on the high-index single-crystal copper affords a higher growth rate than on low-index copper substrates.
Original languageEnglish
Journal2D Materials
Volume8
Issue number3
DOIs
Publication statusPublished - Apr 2021

Keywords

  • single-crystal copper foils high-index planes abnormal grain growth incisions high-temperature annealing graphene

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