Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology

Yulong Chen; Xiewen Wen; King Ning Tu; Yingxia Liu

doi:10.1109/ICTA60488.2023.10364268

Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology

Yulong Chen, Xiewen Wen, King Ning Tu, Yingxia Liu

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

Abstract

In the semiconductor packaging production line, with the increasing integration of chips, the size and pitch of solder joints are decreasing, which puts high demands on the alignment process. Especially with the emergence of chiplet and die-to-wafer technology, high-precision and high-speed alignment technology has become popular. In this paper, based on some image processing schemes, we propose a machine vision algorithm for realizing high-precision and high-speed flip chip bonding, and a flip chip bonding system is then constructed. Finally, the idea for the realization of the die-to-wafer bonding system is discussed.

Original language	English
Title of host publication	Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	25-26
Number of pages	2
ISBN (Electronic)	9798350344288
DOIs	https://doi.org/10.1109/ICTA60488.2023.10364268
Publication status	Published - Oct 2023
Event	2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023 - Hefei, China Duration: 27 Oct 2023 → 29 Oct 2023

Publication series

Name	Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023

Conference

Conference	2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023
Country/Territory	China
City	Hefei
Period	27/10/23 → 29/10/23

Keywords

3D integration
Die-to-wafer bonding technology
Flip chip assembly
Heterogeneous integration

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering
Electronic, Optical and Magnetic Materials
Surfaces, Coatings and Films
Instrumentation
Atomic and Molecular Physics, and Optics

More information

10.1109/ICTA60488.2023.10364268

Cite this

Chen, Y., Wen, X., Tu, K. N., & Liu, Y. (2023). Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. In Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023 (pp. 25-26). (Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/ICTA60488.2023.10364268

Chen, Yulong ; Wen, Xiewen ; Tu, King Ning et al. / Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. pp. 25-26 (Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023).

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title = "Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology",

abstract = "In the semiconductor packaging production line, with the increasing integration of chips, the size and pitch of solder joints are decreasing, which puts high demands on the alignment process. Especially with the emergence of chiplet and die-to-wafer technology, high-precision and high-speed alignment technology has become popular. In this paper, based on some image processing schemes, we propose a machine vision algorithm for realizing high-precision and high-speed flip chip bonding, and a flip chip bonding system is then constructed. Finally, the idea for the realization of the die-to-wafer bonding system is discussed.",

keywords = "3D integration, Die-to-wafer bonding technology, Flip chip assembly, Heterogeneous integration",

author = "Yulong Chen and Xiewen Wen and Tu, {King Ning} and Yingxia Liu",

note = "Publisher Copyright: {\textcopyright} 2023 IEEE.; 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023 ; Conference date: 27-10-2023 Through 29-10-2023",

year = "2023",

month = oct,

doi = "10.1109/ICTA60488.2023.10364268",

language = "English",

series = "Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "25--26",

booktitle = "Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023",

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Chen, Y, Wen, X, Tu, KN & Liu, Y 2023, Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. in Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023. Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023, Institute of Electrical and Electronics Engineers Inc., pp. 25-26, 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023, Hefei, China, 27/10/23. https://doi.org/10.1109/ICTA60488.2023.10364268

Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. / Chen, Yulong; Wen, Xiewen; Tu, King Ning et al.
Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023. Institute of Electrical and Electronics Engineers Inc., 2023. p. 25-26 (Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023).

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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T1 - Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology

AU - Chen, Yulong

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N2 - In the semiconductor packaging production line, with the increasing integration of chips, the size and pitch of solder joints are decreasing, which puts high demands on the alignment process. Especially with the emergence of chiplet and die-to-wafer technology, high-precision and high-speed alignment technology has become popular. In this paper, based on some image processing schemes, we propose a machine vision algorithm for realizing high-precision and high-speed flip chip bonding, and a flip chip bonding system is then constructed. Finally, the idea for the realization of the die-to-wafer bonding system is discussed.

AB - In the semiconductor packaging production line, with the increasing integration of chips, the size and pitch of solder joints are decreasing, which puts high demands on the alignment process. Especially with the emergence of chiplet and die-to-wafer technology, high-precision and high-speed alignment technology has become popular. In this paper, based on some image processing schemes, we propose a machine vision algorithm for realizing high-precision and high-speed flip chip bonding, and a flip chip bonding system is then constructed. Finally, the idea for the realization of the die-to-wafer bonding system is discussed.

KW - 3D integration

KW - Die-to-wafer bonding technology

KW - Flip chip assembly

KW - Heterogeneous integration

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BT - Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023

PB - Institute of Electrical and Electronics Engineers Inc.

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Chen Y, Wen X, Tu KN, Liu Y. Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology. In Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023. Institute of Electrical and Electronics Engineers Inc. 2023. p. 25-26. (Proceedings of 2023 IEEE International Conference on Integrated Circuits, Technologies and Applications, ICTA 2023). doi: 10.1109/ICTA60488.2023.10364268

Fast and Accurate Alignment and Bonding System Based on Advanced Packaging Technology

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