@inproceedings{712d043a255e48b089d72879e89a90d6,
title = "Failure mechanisms of interconnections in drop impact",
abstract = "This study performs experimental tracking of crack propagation (Stage II fatigue) in a single solder interconnection during drop impact. A high resolution, high-speed four-point resistance measurement system is used for tracking crack progression. Results indicate that most of the drop impact low-cycle fatigue life of the solder joint is spent in the crack initiation stage. Cross-sections and fractographs show that various mixes of intermetallic and bulk failure are possible within a single joint. Several failure mechanisms are suggested. Comparisons of failure modes are also made between drop impact, quasi-static loading and high-cycle fatigue. A thorough understanding of failure mechanisms is important for the development of failure criteria and life prediction models for drop impact.",
author = "Seah, {S. K.W.} and Wong, {E. H.} and Mai, {Y. W.} and R. Rajoo and Lim, {C. T.}",
year = "2006",
doi = "10.1109/ECTC.2006.1645852",
language = "English",
isbn = "1424401526",
series = "Proceedings - Electronic Components and Technology Conference",
pages = "1484--1492",
booktitle = "Proceedings - IEEE 56th Electronic Components and Technology Conference",
note = "IEEE 56th Electronic Components and Technology Conference ; Conference date: 30-05-2006 Through 02-06-2006",
}