Abstract
A novel failure mechanism of the high resistance contact revealed by TEM study is presented. Direct evidences are provided to show the impact of process changes to the contact structure which may correlate to the high resistance.
Original language | English |
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Title of host publication | Proceedings of the International Symposium on the Physical and Failure Analysis of Integrated Circuits, IPFA |
Pages | 130-133 |
Number of pages | 4 |
Publication status | Published - 1 Jan 2001 |
Externally published | Yes |
Event | 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2001) - Singapure, Singapore Duration: 9 Jul 2001 → 13 Jul 2001 |
Conference
Conference | 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2001) |
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Country/Territory | Singapore |
City | Singapure |
Period | 9/07/01 → 13/07/01 |
ASJC Scopus subject areas
- Engineering(all)