Abstract
In this letter, we present the implementation of a new raised source/drain (S/D) gate-all-around transistor (GAT). The device is fabricated on a bulk silicon wafer using a technique known as metal-induced-lateral-crystallization (MILC). Compared to conventional single gate MOSFETs, the GAT shows a smaller subthreshold-slope (SS), reduced drain-induced barrier lowering (DIBL), and almost doubled (187%) drive current. Gate misalignment is briefly studied using this novel device. It is found that the SS, DIBL, and drive current will degrade abruptly when gate misalignment is larger than 17% of gate length.
Original language | English |
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Pages (from-to) | 658-660 |
Number of pages | 3 |
Journal | IEEE Electron Device Letters |
Volume | 24 |
Issue number | 10 |
DOIs | |
Publication status | Published - 1 Oct 2003 |
Externally published | Yes |
Keywords
- Double-gate transistor
- Gate misalignment
- Gate-all-around transistor (GAT)
- Metal-induced-lateral-crystallization (MILC)
- Raised source/drain
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Electrical and Electronic Engineering