Fabrication of a microcoil through parallel microassembly

Kar Hang Chu, James K. Mills, William L. Cleghorn

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

5 Citations (Scopus)

Abstract

This paper presents the fabrication of a three-dimensional microcoil through the technique of microassembly. The microcoil design is comprised of nine out-of-plane micro-sized windings. Each winding was assembled onto the base substrate orthogonally by a robotic manipulator through microassembly. In contrast to the conventional serial pick-and-place microassembly, this work incorporated the approach of parallel microassembly to grasp and assemble three windings onto the base substrate simultaneously for increased productivity. In addition, a vision-based algorithm was developed to automate the parallel grasping process of three windings. This algorithm utilized well-defined templates to provide high-precision position and orientation evaluations for the micro-sized components. The performance of the microcoil fabrication process was evaluated and discussed. To establish better electrical contact between the windings and the base substrate, conductive adhesive was introduced in the assembly process and the electrical properties of the assembled microcoil structure were examined.
Original languageEnglish
Title of host publication2012 IEEE International Conference on Robotics and Automation, ICRA 2012
PublisherIEEE
Pages5050-5055
Number of pages6
ISBN (Print)9781467314039
DOIs
Publication statusPublished - 1 Jan 2012
Externally publishedYes
Event2012 IEEE International Conference on Robotics and Automation, ICRA 2012 - Saint Paul, MN, United States
Duration: 14 May 201218 May 2012

Conference

Conference2012 IEEE International Conference on Robotics and Automation, ICRA 2012
Country/TerritoryUnited States
CitySaint Paul, MN
Period14/05/1218/05/12

ASJC Scopus subject areas

  • Software
  • Control and Systems Engineering
  • Artificial Intelligence
  • Electrical and Electronic Engineering

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