Abstract
An experimental investigation has been performed to determine the effects of different arrangements of obstacles on the cooling of simulated electronic package. The considered simulated electronic package consisted of a channel formed by two parallel plates. The bottom plate is attached with five identical electrically heated square obstacles, which are perpendicular to the mean airflow and arranged with different side-to-side distances. The experimental results show that the conventional equi-spaced arrangement might not be the optimum option and should be avoided. A better thermal performance could be obtained when the side-to-side distances between the obstacles followed a geometric series. For example, at Re = 800, the highest temperature of the optimum arrangement could be reduced by 12% compare to the equi-spaced arrangement and the maximum temperature difference among the five obstacles is lower than that of equi-spaced arrangement by 32.1%.
Original language | English |
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Pages (from-to) | 251-257 |
Number of pages | 7 |
Journal | Heat and Mass Transfer/Waerme- und Stoffuebertragung |
Volume | 37 |
Issue number | 2-3 |
DOIs | |
Publication status | Published - 1 Apr 2001 |
ASJC Scopus subject areas
- Condensed Matter Physics
- Fluid Flow and Transfer Processes