Evaluation of mode-II fracture energy of adhesive joints with different bond thickness

A study on the mode-II edge-sliding fracture behaviour of aluminium-adhesive joints was carried out. Compact pure shear (CPS) adhesive joints of different bond thickness were produced using a rubber-modified epoxy resin as the adhesive. An analytical model was developed to calculate the stress distribution along the bond line of the joint. A crack-closure technique was used to evaluate the mode-II strain energy release rate, G_II, as a function of the adhesive bond thickness. The results indicated that for a given applied load, G_II increased gradually with the bond thickness. A finite element model (FEM) was also developed to evaluate the stress state along the bond line and the strain energy release rate of the CPS specimens. Consistent results were obtained between the theoretical model and finite element analysis. Scanning electron micrographs of the fracture surface illustrated a mainly interfacial fracture path between the adherends and the adhesive for all adhesive joint specimens. The critical fracture load increased very rapidly with bond thickness in the range 0.02 mm to 0.1 mm but remained constant thereafter. However, the mode-II critical fracture energy rose more gradually as the bond thickness was increased.