Abstract
This paper presents the implementation method of surface modification by hydrogen ion implantation in silicon on the enhancement of machinability of silicon by facilitating the brittle-to-ductile transition. The distribution of the implanted hydrogen ions and induced displacements in the sub-surface of silicon wafer is visualised through modelling. The micro-cutting experiments are conducted on ultra-precision raster milling to verify the enhancement effect on the machinability of silicon.
| Original language | English |
|---|---|
| Pages (from-to) | 50-55 |
| Number of pages | 6 |
| Journal | International Journal of Machine Tools and Manufacture |
| Volume | 74 |
| DOIs | |
| Publication status | Published - 4 Sept 2013 |
Keywords
- Brittle-to-ductile transition
- Hydrogen ion implantation
- Machinability
- Silicon
- Ultra-precision micro-cutting
ASJC Scopus subject areas
- Industrial and Manufacturing Engineering
- Mechanical Engineering
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