Enhancement of the machinability of silicon by hydrogen ion implantation for ultra-precision micro-cutting

Suet To, H. Wang, E. V. Jelenković

Research output: Journal article publicationJournal articleAcademic researchpeer-review

34 Citations (Scopus)

Abstract

This paper presents the implementation method of surface modification by hydrogen ion implantation in silicon on the enhancement of machinability of silicon by facilitating the brittle-to-ductile transition. The distribution of the implanted hydrogen ions and induced displacements in the sub-surface of silicon wafer is visualised through modelling. The micro-cutting experiments are conducted on ultra-precision raster milling to verify the enhancement effect on the machinability of silicon.
Original languageEnglish
Pages (from-to)50-55
Number of pages6
JournalInternational Journal of Machine Tools and Manufacture
Volume74
DOIs
Publication statusPublished - 4 Sep 2013

Keywords

  • Brittle-to-ductile transition
  • Hydrogen ion implantation
  • Machinability
  • Silicon
  • Ultra-precision micro-cutting

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

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