Enhancement of the machinability of silicon by hydrogen ion implantation for ultra-precision micro-cutting

Suet To, H. Wang, E. V. Jelenković

Research output: Journal article publicationJournal articleAcademic researchpeer-review

34 Citations (Scopus)


This paper presents the implementation method of surface modification by hydrogen ion implantation in silicon on the enhancement of machinability of silicon by facilitating the brittle-to-ductile transition. The distribution of the implanted hydrogen ions and induced displacements in the sub-surface of silicon wafer is visualised through modelling. The micro-cutting experiments are conducted on ultra-precision raster milling to verify the enhancement effect on the machinability of silicon.
Original languageEnglish
Pages (from-to)50-55
Number of pages6
JournalInternational Journal of Machine Tools and Manufacture
Publication statusPublished - 4 Sep 2013


  • Brittle-to-ductile transition
  • Hydrogen ion implantation
  • Machinability
  • Silicon
  • Ultra-precision micro-cutting

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering

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