Enhanced thermal conductivity of boron nitride epoxy-matrix composite through multi-modal particle size mixing

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Castable particulate-filled epoxy resins exhibiting excellent thermal conductivity have been prepared using hexagonal boron nitride (hBN) and cubic boron nitride (cBN) as fillers. The thermal conductivity of boron nitride filled epoxy matrix composites was enhanced up to 217% through silane surface treatment of fillers and multi-modal particle size mixing (two different hBN particle sizes and one cBN particle size) prior to fabricating the composite. The measurements and interpretation of the curing kinetics of anhydride cured epoxies as continuous matrix, loaded with BN having multi-modal particle size distribution, as heat conductive fillers, are highlighted. This study evidences the importance of surface engineering and multi-modal mixing distribution applied in inorganic fillered epoxy-matrix composite.
Original languageEnglish
Pages (from-to)3587-3591
Number of pages5
JournalJournal of Applied Polymer Science
Issue number6
Publication statusPublished - 15 Dec 2007


  • Boron nitride
  • Composite
  • Epoxy
  • Thermal conductivity
  • Thermogram

ASJC Scopus subject areas

  • Chemistry(all)
  • Surfaces, Coatings and Films
  • Polymers and Plastics
  • Materials Chemistry

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