Electromagnetic shielding and corrosion resistance of electroless Ni-P/Cu-Ni multilayer plated polyester fabric

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Nickel-phosphorus/copper-nickel (Ni-P/Cu-Ni) multilayers are electroless deposited onto polyester fabric as a function of the deposition time of Ni-P and compared with Ni-P and Cu-Ni deposits. Their surface morphology, microstructure and composition are analyzed by using scanning electron microscopy (SEM), X-ray diffraction (XRD) and energy-dispersive X-ray (EDX). Their electromagnetic interference (EMI) shielding effectiveness (SE) is evaluated and corrosion resistance is characterized by electrochemical polarization measurements. The results show that with the same weight of the deposits, the EMI SE of the Ni-P/Cu-Ni plated fabric is higher than that of the Ni-P plated fabric, while the corrosion resistance of the Ni-P/Cu-Ni plated fabrics is better than the Cu-Ni plated fabrics. Ni-P improves corrosion resistance and greatly enhances the electromagnetic shielding property of Ni-P/Cu-Ni deposits. Furthermore, the EMI SE and corrosion resistance of the Ni-P/Cu-Ni deposits increase with the rise of deposition time of Ni-P. Therefore, electroless Ni-P/Cu-Ni plated fabric is the most appropriate material that will meet the requirements of both corrosion resistance and EMI SE in most textile applications.
Original languageEnglish
Pages (from-to)4274-4279
Number of pages6
JournalSurface and Coatings Technology
Issue number17-18
Publication statusPublished - 25 May 2011


  • Corrosion resistance
  • Electroless plating
  • Electromagnetic interference shielding
  • Microstructure
  • Ni-P/Cu-Ni multilayer
  • Polyester fabric

ASJC Scopus subject areas

  • Chemistry(all)
  • Condensed Matter Physics
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Materials Chemistry

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