Keyphrases
Added Damping
25%
Applications in Electronics
25%
Damping Capability
25%
Damping Performance
25%
Effective Temperature
25%
Elastomer
50%
Elastomer Composites
100%
Electronic Devices
25%
Energy Dissipation
25%
Heat Accumulation
25%
Heat Dissipation
25%
Heat Dissipation Capability
25%
Hierarchical Hydrogen Bonds
25%
Hierarchical Interaction
100%
High Damping
100%
Hydrogen Bonding Interaction
25%
Loss Factor
25%
Low Thermal Resistance
100%
Microelectronics
25%
Polybutadiene
75%
Soft Robotics
25%
Storage Losses
25%
Storage Modulus
25%
Strong Coupling
25%
Thermal Conductance
25%
Thermal Conductive Filler
25%
Thermal Damping
25%
Thermal Interface Materials
25%
Wearable Electronics
25%
Material Science
Aluminum
50%
Composite Material
100%
Elastic Moduli
16%
Elastomer
100%
Heat Resistance
100%
Hydrogen Bonding
16%
Interface (Material)
16%
Polybutadiene
50%
Chemical Engineering
Chilling
33%
Elastomer
100%
Polybutadiene
50%