Efficient fabrication of gradient nanostructure layer on surface of commercial pure copper by coupling electric pulse and ultrasonics treatment

Keyphrases

• Ultrasonic Treatment 100%
• Pure Copper 100%
• Gradient Nanostructure 100%
• Electric Pulse Treatment 100%
• Severe Plastic Deformation 40%
• Microstructure 20%
• Ultrasonic 20%
• Average Grain Size 20%
• X Ray Diffraction 20%
• Grain Boundary 20%
• Transmission Electron Microscope 20%
• Micromechanics 20%
• Costing Methods 20%
• Size Reduction 20%
• Metal Surface 20%
• Pulse Current 20%
• Highest Peak 20%
• Thermoelectric Properties 20%
• Computational Model 20%
• High Electrical Conductivity 20%
• Electron Backscatter Diffraction 20%
• Copper Surface 20%
• Thermal-mechanical 20%
• Graded Materials 20%
• High Thermal Conductivity 20%
• Mechanical Phenomena 20%
• Grain Refinement 20%
• Mechanical Shock 20%
• Microthermal 20%
• Nanostructured Metal Surface 20%
• Thermal Shock 20%
• Grain Refinement Strengthening 20%
• Gradient Nanostructured Metals 20%
• Nanoindentation Measurement 20%
• Plastic Deformation Layer 20%

Material Science

• Nanostructure 100%
• Surface (Surface Science) 100%
• Grain Refinement 66%
• Plastic Deformation 66%
• Metal Surface 66%
• Thermal Conductivity 33%
• Electron Backscatter Diffraction 33%
• Nanoindentation 33%
• Thermal Shock 33%
• Grain Size 33%
• Mechanical Phenomenon 33%
• X-Ray Diffraction 33%
• Electrical Conductivity 33%
• Grain Boundaries 33%

Engineering

• Nanomaterial 100%
• Pure Copper 100%
• Ultrasonics 100%
• Plastic Deformation 33%
• High Thermal Conductivity 16%
• High Electrical Conductivity 16%
• Average Grain Size 16%
• Current Pulse 16%
• Ray Diffraction 16%
• Sample Surface 16%
• Indentation 16%
• Mechanical Phenomenon 16%
• Grain Boundaries 16%
• Mechanical Shock 16%