Effects of process parameters on the replica shape in glass hot embossing

Gao Yang, Chi Fai Cheung, Man Cheung Ng, Feng Gong

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

Hot embossing is a promising replication technology for precision manufacture of glass micro optical components. However, the optical performance of thermally imprinted micro optical components is significantly deteriorated due to the warpage formed on their global surfaces. The control of surface roughness and replica thickness are also vital in practical applications. This study attempts to experimentally evaluate the effects of different process parameters (i.e., embossing temperature, embossing force, isothermal pressing time, annealing rate, maintenance force and fast cooling point) on the shape parameters (i.e., curvature radius, mean surface roughness and thickness) of glass replica. The results provide an important means for minimizing the warpage, reducing surface roughness and controlling replica thickness in hot embossing. In this study, a series of glass hot embossing experiments were conducted by a commercially avaliable precision glass molding machine. The surface topography was measured on both the top and the bottom surfaces of embossed glass replicas. The thickness and diameter of the replicas were also measured. The experimental results were then analyzed for quantifying the effects of different process parameters on the shape parameters. The results of this study provide optimal process parameters for minimizing the warpage of the replica shapee for practical hot embossing applications.
Original languageEnglish
Title of host publicationProceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology
EditorsRichard Leach, D. Billington, C. Nisbet, D. Phillips
Place of PublicationUnited Kingdom
Publishereuspen
Pages167-170
Number of pages4
ISBN (Print)978-0-9957751-7-6
Publication statusPublished - Jun 2020
Event20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020 - Geneva, Virtual, Austria
Duration: 8 Jun 202012 Jun 2020

Conference

Conference20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020
Country/TerritoryAustria
CityGeneva, Virtual
Period8/06/2012/06/20

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