Abstract
Hot embossing is a promising replication technology for precision manufacture of glass micro optical components. However, the optical performance of thermally imprinted micro optical components is significantly deteriorated due to the warpage formed on their global surfaces. The control of surface roughness and replica thickness are also vital in practical applications. This study attempts to experimentally evaluate the effects of different process parameters (i.e., embossing temperature, embossing force, isothermal pressing time, annealing rate, maintenance force and fast cooling point) on the shape parameters (i.e., curvature radius, mean surface roughness and thickness) of glass replica. The results provide an important means for minimizing the warpage, reducing surface roughness and controlling replica thickness in hot embossing. In this study, a series of glass hot embossing experiments were conducted by a commercially avaliable precision glass molding machine. The surface topography was measured on both the top and the bottom surfaces of embossed glass replicas. The thickness and diameter of the replicas were also measured. The experimental results were then analyzed for quantifying the effects of different process parameters on the shape parameters. The results of this study provide optimal process parameters for minimizing the warpage of the replica shapee for practical hot embossing applications.
Original language | English |
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Title of host publication | Proceedings of the 20th International Conference of the European Society for Precision Engineering and Nanotechnology |
Editors | Richard Leach, D. Billington, C. Nisbet, D. Phillips |
Place of Publication | United Kingdom |
Publisher | euspen |
Pages | 167-170 |
Number of pages | 4 |
ISBN (Print) | 978-0-9957751-7-6 |
Publication status | Published - Jun 2020 |
Event | 20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020 - Geneva, Virtual, Austria Duration: 8 Jun 2020 → 12 Jun 2020 |
Conference
Conference | 20th International Conference of the European Society for Precision Engineering and Nanotechnology, EUSPEN 2020 |
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Country/Territory | Austria |
City | Geneva, Virtual |
Period | 8/06/20 → 12/06/20 |