Effects of nano-aluminum nitride on the performance of an ultrahigh-temperature inorganic phosphate adhesive cured at room temperature

Chengkun Ma, Hailong Chen, Chao Wang, Jifeng Zhang, Hui Qi, Li Min Zhou

Research output: Journal article publicationJournal articleAcademic researchpeer-review

13 Citations (Scopus)


Based on the optimal proportion of resin and curing agent, an ultrahigh-temperature inorganic phosphate adhesive was prepared with aluminum dihydric phosphate, aluminium oxide (α-Al2O3), etc. and cured at room temperature (RT). Then, nano-aluminum nitride (nano-AlN), nano-Cupric oxide (nano-CuO), and nano-titanium oxide (nano-TiO2) were added into the adhesive. Differential scanning calorimetry was conducted using the inorganic phosphate adhesive to analyze the phosphate reactions during heat treatment, and it was found that 15 wt % nano-AlN could clearly decrease the curing temperature. Scanning electron microscopy was used to observe the microphenomenon of the modified adhesive at ultrahigh-temperature. The differential thermal analysis of the inorganic phosphate adhesive showed that the weight loss was approximately 6.5 wt % when the mass ratio of resin to curing agent was 1:1.5. An X-ray diffraction analysis of the adhesive with 10% nano-AlN showed that the phase structure changed from AlPO4(11-0500) to the more stable AlPO4(10-0423) structure after heat treatment. The shear strength of the adhesive containing 10% nano-AlN reached 7.3 MPa at RT due to the addition of nano-AlN, which promoted the formation of phosphate and increased the Al3+.
Original languageEnglish
Article number1266
Issue number11
Publication statusPublished - 1 Nov 2017


  • Inorganic phosphate adhesive
  • Modified
  • Room temperature curing
  • Shear strength
  • Ultrahigh-temperature

ASJC Scopus subject areas

  • Materials Science(all)

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