Effect of tool drop on the performance of a high-frequency piezoelectric wire-bonding transducer system

Siu Wing Or, Helen Lai Wah Chan, Kei Chun Cheng, Yiu Ming Cheung, Chi Wah Yuen, Peter Chou Kee Liu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

1 Citation (Scopus)


This work describes a method to determine a suitable tool drop for clamping the bonding tool in a high-frequency (130 kHz) piezoelectric horn transducer used for wire bonding. Effect of different tool drops on four critical parameters, namely, the resonant frequency, the electrical impedance, the phase angle, and the tool tip displacement amplitude, were studied with the transducer system being driven at normal bonding power. Strong interdependence was observed among these parameters. The results were interpreted from the system stability and other physical point of views. Appropriate ranges of tool drop were found. With the tool drop in these ranges, it can produce desirable characteristics for the wire bonding.
Original languageEnglish
Pages (from-to)217-222
Number of pages6
Issue number1-4
Publication statusPublished - 1 Jan 1999


  • Bonding tool
  • High-frequency wire bonding
  • Ultrasonic transducer

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

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