Effect of tool drop on the performance of a high-frequency piezoelectric wire-bonding transducer system

Siu Wing Or; Helen Lai Wah Chan; Kei Chun Cheng; Yiu Ming Cheung; Chi Wah Yuen; Peter Chou Kee Liu

doi:10.1080/00150199908015794

Effect of tool drop on the performance of a high-frequency piezoelectric wire-bonding transducer system

Siu Wing Or, Helen Lai Wah Chan, Kei Chun Cheng, Yiu Ming Cheung, Chi Wah Yuen, Peter Chou Kee Liu

The Hong Kong Polytechnic University

Research output: Journal article publication › Journal article › Academic research › peer-review

1 Citation (Scopus)

Abstract

This work describes a method to determine a suitable tool drop for clamping the bonding tool in a high-frequency (130 kHz) piezoelectric horn transducer used for wire bonding. Effect of different tool drops on four critical parameters, namely, the resonant frequency, the electrical impedance, the phase angle, and the tool tip displacement amplitude, were studied with the transducer system being driven at normal bonding power. Strong interdependence was observed among these parameters. The results were interpreted from the system stability and other physical point of views. Appropriate ranges of tool drop were found. With the tool drop in these ranges, it can produce desirable characteristics for the wire bonding.

Original language	English
Pages (from-to)	217-222
Number of pages	6
Journal	Ferroelectrics
Volume	232
Issue number	1-4
DOIs	https://doi.org/10.1080/00150199908015794
Publication status	Published - 1 Jan 1999

Keywords

Bonding tool
High-frequency wire bonding
Ultrasonic transducer

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Condensed Matter Physics

More information

10.1080/00150199908015794

Cite this

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title = "Effect of tool drop on the performance of a high-frequency piezoelectric wire-bonding transducer system",

abstract = "This work describes a method to determine a suitable tool drop for clamping the bonding tool in a high-frequency (130 kHz) piezoelectric horn transducer used for wire bonding. Effect of different tool drops on four critical parameters, namely, the resonant frequency, the electrical impedance, the phase angle, and the tool tip displacement amplitude, were studied with the transducer system being driven at normal bonding power. Strong interdependence was observed among these parameters. The results were interpreted from the system stability and other physical point of views. Appropriate ranges of tool drop were found. With the tool drop in these ranges, it can produce desirable characteristics for the wire bonding.",

keywords = "Bonding tool, High-frequency wire bonding, Ultrasonic transducer",

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AU - Cheng, Kei Chun

AU - Cheung, Yiu Ming

AU - Yuen, Chi Wah

AU - Liu, Peter Chou Kee

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N2 - This work describes a method to determine a suitable tool drop for clamping the bonding tool in a high-frequency (130 kHz) piezoelectric horn transducer used for wire bonding. Effect of different tool drops on four critical parameters, namely, the resonant frequency, the electrical impedance, the phase angle, and the tool tip displacement amplitude, were studied with the transducer system being driven at normal bonding power. Strong interdependence was observed among these parameters. The results were interpreted from the system stability and other physical point of views. Appropriate ranges of tool drop were found. With the tool drop in these ranges, it can produce desirable characteristics for the wire bonding.

AB - This work describes a method to determine a suitable tool drop for clamping the bonding tool in a high-frequency (130 kHz) piezoelectric horn transducer used for wire bonding. Effect of different tool drops on four critical parameters, namely, the resonant frequency, the electrical impedance, the phase angle, and the tool tip displacement amplitude, were studied with the transducer system being driven at normal bonding power. Strong interdependence was observed among these parameters. The results were interpreted from the system stability and other physical point of views. Appropriate ranges of tool drop were found. With the tool drop in these ranges, it can produce desirable characteristics for the wire bonding.

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Effect of tool drop on the performance of a high-frequency piezoelectric wire-bonding transducer system

Abstract

Keywords

ASJC Scopus subject areas

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