TY - GEN
T1 - Effect of Surface Temperature on Finger Friction and Perception in Electroadhesion
AU - Choi, Changhyun
AU - Ma, Yuan
AU - Sequeira, Sneha
AU - Chatterjee, Sitangshu
AU - Li, Xinyi
AU - Felts, Jonathan R.
AU - Hipwell, M. Cynthia
N1 - Publisher Copyright:
© 2021 IEEE.
PY - 2021/7/6
Y1 - 2021/7/6
N2 - Electroadhesion, which modulates finger friction force through electrostatic force, is a widely used surface haptic approach for touch-based applications due to an absence of moving parts and wide bandwidth. Although there have been many studies on the electronics and mechanics of electroadhesion, little is known about how surface temperature variation or purposeful temperature modulation influences electroadhesion. Here we study the effect of surface temperature on electroadhesion, especially absolute threshold voltage to perceive the electroadhesion through psychophysical experiments followed by friction measurements to understand the physics behind the results. We found that the threshold voltage is lower at a higher temperature due to different frictional behaviors of the fingerpad at different temperatures.
AB - Electroadhesion, which modulates finger friction force through electrostatic force, is a widely used surface haptic approach for touch-based applications due to an absence of moving parts and wide bandwidth. Although there have been many studies on the electronics and mechanics of electroadhesion, little is known about how surface temperature variation or purposeful temperature modulation influences electroadhesion. Here we study the effect of surface temperature on electroadhesion, especially absolute threshold voltage to perceive the electroadhesion through psychophysical experiments followed by friction measurements to understand the physics behind the results. We found that the threshold voltage is lower at a higher temperature due to different frictional behaviors of the fingerpad at different temperatures.
UR - http://www.scopus.com/inward/record.url?scp=85115120337&partnerID=8YFLogxK
U2 - 10.1109/WHC49131.2021.9517137
DO - 10.1109/WHC49131.2021.9517137
M3 - Conference article published in proceeding or book
AN - SCOPUS:85115120337
T3 - 2021 IEEE World Haptics Conference, WHC 2021
SP - 680
EP - 684
BT - 2021 IEEE World Haptics Conference, WHC 2021
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 2021 IEEE World Haptics Conference, WHC 2021
Y2 - 6 July 2021 through 9 July 2021
ER -