Effect of Stress-Dependent Thermal Conductivity on Thermo-Mechanical Coupling Behavior in GaN-Based Nanofilm Under Pulse Heat Source

Qicong Li, Xiaoya Tang, Linli Zhu, Haihui Ruan

Research output: Journal article publicationJournal articleAcademic researchpeer-review

Abstract

The thermal properties of a nanostructured semiconductor are affected by multi-physical fields, such as stress and electromagnetic fields, causing changes in temperature and strain distributions. In this work, the influence of stress-dependent thermal conductivity on the heat transfer behavior of a GaN-based nanofilm is investigated. The finite element method is adopted to simulate the temperature distribution in a prestressed nanofilm under heat pulses. Numerical results demonstrate the effect of stress field on the thermal conductivity of GaN-based nanofilm, namely, the prestress and the thermal stress lead to a change in the heat transfer behavior in the nanofilm. Under the same heat source, the peak temperature of the film with stress-dependent thermal conductivity is significantly lower than that of the film with a constant thermal conductivity and the maximum temperature difference can reach 8.2 K. These results could be useful for designing GaN-based semiconductor devices with higher reliability under multi-physical fields.

Original languageEnglish
Pages (from-to)27-39
Number of pages13
JournalActa Mechanica Solida Sinica
Volume34
Issue number1
DOIs
Publication statusPublished - Feb 2021

Keywords

  • Finite element method
  • GaN-based nanofilm
  • Heat transfer behavior
  • Multi-physical effect
  • Prestress fields
  • Stress-dependent thermal conductivity

ASJC Scopus subject areas

  • Computational Mechanics
  • Mechanics of Materials
  • Mechanical Engineering

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