Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions

Asit Kumar Gaina; Y. C. Chan; Ahmed Sharif; Kam Chuen Yung

doi:10.1109/ECTC.2009.5074137

Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions

Asit Kumar Gaina, Y. C. Chan, Ahmed Sharif, Kam Chuen Yung

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

1 Citation (Scopus)

Abstract

Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles and aging time. In the solder ball region, fine acicularshaped Zn-rich phase and spherical-shaped AgZn3 compound particles were found in β-Sn matrix. The shear strength of monolithic Sn-Zn-Bi and 7wt% Sn-Ag-Cu content Sn-Zn-Bi solder joints after one reflow cycle were about 44.5MPa and 53.1MPa, respectively while their shear strengths after eight reflow cycles were about 43.4MPa and 51.6MPa, respectively. The fracture surface of monolithic Sn-Zn-Bi solder exhibited a semi ductile fracture mode with a smooth surface while Sn-Zn-Bi solder joints containing Sn-Ag-Cu particles showed a typical ductile failure with very rough dimpled surfaces.

Original language	English
Title of host publication	2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009
Pages	1021-1026
Number of pages	6
DOIs	https://doi.org/10.1109/ECTC.2009.5074137
Publication status	Published - 12 Oct 2009
Event	2009 59th Electronic Components and Technology Conference, ECTC 2009 - San Diego, CA, United States Duration: 26 May 2009 → 29 May 2009

Conference

Conference	2009 59th Electronic Components and Technology Conference, ECTC 2009
Country/Territory	United States
City	San Diego, CA
Period	26/05/09 → 29/05/09

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Electrical and Electronic Engineering

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10.1109/ECTC.2009.5074137

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title = "Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions",

abstract = "Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles and aging time. In the solder ball region, fine acicularshaped Zn-rich phase and spherical-shaped AgZn3 compound particles were found in β-Sn matrix. The shear strength of monolithic Sn-Zn-Bi and 7wt% Sn-Ag-Cu content Sn-Zn-Bi solder joints after one reflow cycle were about 44.5MPa and 53.1MPa, respectively while their shear strengths after eight reflow cycles were about 43.4MPa and 51.6MPa, respectively. The fracture surface of monolithic Sn-Zn-Bi solder exhibited a semi ductile fracture mode with a smooth surface while Sn-Zn-Bi solder joints containing Sn-Ag-Cu particles showed a typical ductile failure with very rough dimpled surfaces.",

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Gaina, AK, Chan, YC, Sharif, A & Yung, KC 2009, Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions. in 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009., 5074137, pp. 1021-1026, 2009 59th Electronic Components and Technology Conference, ECTC 2009, San Diego, CA, United States, 26/05/09. https://doi.org/10.1109/ECTC.2009.5074137

Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions. / Gaina, Asit Kumar; Chan, Y. C.; Sharif, Ahmed; Yung, Kam Chuen.

2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009. 2009. p. 1021-1026 5074137.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AU - Gaina, Asit Kumar

AU - Chan, Y. C.

AU - Sharif, Ahmed

AU - Yung, Kam Chuen

PY - 2009/10/12

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N2 - Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles and aging time. In the solder ball region, fine acicularshaped Zn-rich phase and spherical-shaped AgZn3 compound particles were found in β-Sn matrix. The shear strength of monolithic Sn-Zn-Bi and 7wt% Sn-Ag-Cu content Sn-Zn-Bi solder joints after one reflow cycle were about 44.5MPa and 53.1MPa, respectively while their shear strengths after eight reflow cycles were about 43.4MPa and 51.6MPa, respectively. The fracture surface of monolithic Sn-Zn-Bi solder exhibited a semi ductile fracture mode with a smooth surface while Sn-Zn-Bi solder joints containing Sn-Ag-Cu particles showed a typical ductile failure with very rough dimpled surfaces.

AB - Sn-8Zn-3Bi solder balls with different weight percentages of Sn-Ag-Cu addition were bonded to Au/Ni metallized Cu pads, and the effect of multiple reflow and aging on impact reliability was investigated. In the Sn-Ag-Cu content Sn-Zn-Bi solder joints, the AgZn3 intermetallic compound layer was clearly observed at the interfaces and its thickness increased with an increase the number of reflow cycles and aging time. In the solder ball region, fine acicularshaped Zn-rich phase and spherical-shaped AgZn3 compound particles were found in β-Sn matrix. The shear strength of monolithic Sn-Zn-Bi and 7wt% Sn-Ag-Cu content Sn-Zn-Bi solder joints after one reflow cycle were about 44.5MPa and 53.1MPa, respectively while their shear strengths after eight reflow cycles were about 43.4MPa and 51.6MPa, respectively. The fracture surface of monolithic Sn-Zn-Bi solder exhibited a semi ductile fracture mode with a smooth surface while Sn-Zn-Bi solder joints containing Sn-Ag-Cu particles showed a typical ductile failure with very rough dimpled surfaces.

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BT - 2009 Proceedings 59th Electronic Components and Technology Conference, ECTC 2009

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Y2 - 26 May 2009 through 29 May 2009

ER -

Effect of small Sn-Ag-Cu additions on structure and properties of Sn-Zn-Bi solder/BGA during as-soldered and as-aged conditions

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