Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages

A.K. Gain; Y.C. Chan; Kam Chuen Yung; A. Sharif

Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages

A.K. Gain, Y.C. Chan, Kam Chuen Yung, A. Sharif

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

Original language	English
Pages	1-8
Number of pages	8
Publication status	Published - 2009
Event	Electronic Components and Technology Conference, [ECTC] - Duration: 1 Jan 2009 → …

Conference

Conference	Electronic Components and Technology Conference, [ECTC]
Period	1/01/09 → …

Cite this

@conference{ad98165bf3374277ae141f9a416a79d6,

title = "Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages",

author = "A.K. Gain and Y.C. Chan and Yung, {Kam Chuen} and A. Sharif",

year = "2009",

language = "English",

pages = "1--8",

note = "Electronic Components and Technology Conference, [ECTC] ; Conference date: 01-01-2009",

}

Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages. / Gain, A.K.; Chan, Y.C.; Yung, Kam Chuen et al.
2009. 1-8 Paper presented at Electronic Components and Technology Conference, [ECTC].

Research output: Unpublished conference presentation (presented paper, abstract, poster) › Conference presentation (not published in journal/proceeding/book) › Academic research › peer-review

TY - CONF

T1 - Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages

AU - Gain, A.K.

AU - Chan, Y.C.

AU - Yung, Kam Chuen

AU - Sharif, A.

PY - 2009

Y1 - 2009

M3 - Conference presentation (not published in journal/proceeding/book)

SP - 1

EP - 8

T2 - Electronic Components and Technology Conference, [ECTC]

Y2 - 1 January 2009

ER -