Effect of small Sn-3.5Ag-0.5Cu additions to Sn-8Zn-3Bi solder on interfacial microstructure and properties with ball grid array packages

A.K. Gain, Y.C. Chan, Kam Chuen Yung, A. Sharif

Research output: Unpublished conference presentation (presented paper, abstract, poster)Conference presentation (not published in journal/proceeding/book)Academic researchpeer-review

Original languageEnglish
Number of pages8
Publication statusPublished - 2009
EventElectronic Components and Technology Conference, [ECTC] -
Duration: 1 Jan 2009 → …


ConferenceElectronic Components and Technology Conference, [ECTC]
Period1/01/09 → …

Cite this