Effect of small Sn-3.5Ag-0.5Cu additions on the structure and properties of Sn-9Zn solder in ball grid array packages
- Asit Kumar Gain
- , Y. C. Chan
- , Ahmed Sharif
- , Kam Chuen Yung
Research output: Journal article publication › Journal article › Academic research › peer-review
29
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(Scopus)