Effect of reverse pulse current on the internal stress of electroformed nickel

Kang Cheung Chan, N. S. Qu, D. Zhu

Research output: Journal article publicationJournal articleAcademic researchpeer-review

24 Citations (Scopus)

Abstract

In recent years, much attention has been paid to electroforming as a high-technology manufacturing technique for micro-devices. However, internal stress is one of the major problems required to be solved before this technique can be used widely for the microforming of premium products. There have been a lot of research effort in controlling internal stress, most of which has focused on adjusting the bath, although, this approach has not lead to a significant improvement in the quality of the deposit. In the present paper, the use of reverse pulse current in electroforming has been proposed to enhance the quality of the deposit. A series of experiments have been carried out to study the effect of reverse pulse current on the internal stress of electroformed nickel, a significant reduction in internal stress being achieved.
Original languageEnglish
Pages (from-to)819-822
Number of pages4
JournalJournal of Materials Processing Technology
Volume63
Issue number1-3
DOIs
Publication statusPublished - 1 Jan 1997

Keywords

  • Electroformed nickel
  • Internal stress
  • Reverse pulse current

ASJC Scopus subject areas

  • Ceramics and Composites
  • Computer Science Applications
  • Metals and Alloys
  • Industrial and Manufacturing Engineering

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