Abstract
In recent years, much attention has been paid to electroforming as a high-technology manufacturing technique for micro-devices. However, internal stress is one of the major problems required to be solved before this technique can be used widely for the microforming of premium products. There have been a lot of research effort in controlling internal stress, most of which has focused on adjusting the bath, although, this approach has not lead to a significant improvement in the quality of the deposit. In the present paper, the use of reverse pulse current in electroforming has been proposed to enhance the quality of the deposit. A series of experiments have been carried out to study the effect of reverse pulse current on the internal stress of electroformed nickel, a significant reduction in internal stress being achieved.
Original language | English |
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Pages (from-to) | 819-822 |
Number of pages | 4 |
Journal | Journal of Materials Processing Technology |
Volume | 63 |
Issue number | 1-3 |
DOIs | |
Publication status | Published - 1 Jan 1997 |
Keywords
- Electroformed nickel
- Internal stress
- Reverse pulse current
ASJC Scopus subject areas
- Ceramics and Composites
- Computer Science Applications
- Metals and Alloys
- Industrial and Manufacturing Engineering