Abstract
Hypophosphite as a reducing agent and the effects of the NiSO4 concentration on the chemical composition of the electroless copper plating on polyester fabric were investigated in this study. The results show that at a higher NiSO4 concentration, the copper content in the coating decreases and nickel content increases slightly. Particle sizes of Cu deposits increases with the rise of NiSO4 concentration. It was found that the deposited copper particles were crystalline structure on the surface of polyester fiber according to X ray diffraction analysis. Additionally, an increase in electromagnetic interference (EMI) shielding were developed with an increase of Ni2+ in the electroless plating solution. The results contributed to the improvement in EMI shielding effectiveness using additive nickel ions in electroless copper plating on polyester fabric.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the Fiber Society 2009 Spring Conference |
| Publisher | Donghua University press |
| Pages | 704-708 |
| Number of pages | 5 |
| ISBN (Print) | 9787506456357 |
| Publication status | Published - 1 Jan 2009 |
| Event | International Conference on Fibrous Materials 2009 - Shanghai, China Duration: 27 May 2009 → 29 May 2009 |
Conference
| Conference | International Conference on Fibrous Materials 2009 |
|---|---|
| Country/Territory | China |
| City | Shanghai |
| Period | 27/05/09 → 29/05/09 |
Keywords
- Electroless copper plating
- Electromagnetic interference shielding
- Micro-structure
- Polyester fabric
ASJC Scopus subject areas
- General Materials Science