Effect of Ni2+ concentration in electroless copper plating on polyester fabric

R. H. Guo, S. Q. Jiang, C. W M Yuen, Man Ching Frankie Ng

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

Abstract

Hypophosphite as a reducing agent and the effects of the NiSO4 concentration on the chemical composition of the electroless copper plating on polyester fabric were investigated in this study. The results show that at a higher NiSO4 concentration, the copper content in the coating decreases and nickel content increases slightly. Particle sizes of Cu deposits increases with the rise of NiSO4 concentration. It was found that the deposited copper particles were crystalline structure on the surface of polyester fiber according to X ray diffraction analysis. Additionally, an increase in electromagnetic interference (EMI) shielding were developed with an increase of Ni2+ in the electroless plating solution. The results contributed to the improvement in EMI shielding effectiveness using additive nickel ions in electroless copper plating on polyester fabric.
Original languageEnglish
Title of host publicationProceedings of the Fiber Society 2009 Spring Conference
PublisherDonghua University press
Pages704-708
Number of pages5
ISBN (Print)9787506456357
Publication statusPublished - 1 Jan 2009
EventInternational Conference on Fibrous Materials 2009 - Shanghai, China
Duration: 27 May 200929 May 2009

Conference

ConferenceInternational Conference on Fibrous Materials 2009
CountryChina
CityShanghai
Period27/05/0929/05/09

Keywords

  • Electroless copper plating
  • Electromagnetic interference shielding
  • Micro-structure
  • Polyester fabric

ASJC Scopus subject areas

  • Materials Science(all)

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