Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

Asit Kumar Gain, Y. C. Chan, Kam Chuen Yung, Ahmed Sharif, Latir Ali

Research output: Chapter in book / Conference proceedingConference article published in proceeding or bookAcademic researchpeer-review

4 Citations (Scopus)

Abstract

The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively.
Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages1291-1294
Number of pages4
DOIs
Publication statusPublished - 1 Dec 2008
Event2008 2nd Electronics Systemintegration Technology Conference, ESTC - Greenwich, United Kingdom
Duration: 1 Sep 20084 Sep 2008

Conference

Conference2008 2nd Electronics Systemintegration Technology Conference, ESTC
CountryUnited Kingdom
CityGreenwich
Period1/09/084/09/08

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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