Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

Asit Kumar Gain; Y. C. Chan; Kam Chuen Yung; Ahmed Sharif; Latir Ali

doi:10.1109/ESTC.2008.4684540

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

Asit Kumar Gain, Y. C. Chan, Kam Chuen Yung, Ahmed Sharif, Latir Ali

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

5 Citations (Scopus)

Abstract

The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively.

Original language	English
Title of host publication	Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages	1291-1294
Number of pages	4
DOIs	https://doi.org/10.1109/ESTC.2008.4684540
Publication status	Published - 1 Dec 2008
Event	2008 2nd Electronics Systemintegration Technology Conference, ESTC - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008

Conference

Conference	2008 2nd Electronics Systemintegration Technology Conference, ESTC
Country/Territory	United Kingdom
City	Greenwich
Period	1/09/08 → 4/09/08

ASJC Scopus subject areas

Control and Systems Engineering
Electrical and Electronic Engineering

More information

10.1109/ESTC.2008.4684540

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title = "Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages",

abstract = "The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively.",

author = "Gain, {Asit Kumar} and Chan, {Y. C.} and Yung, {Kam Chuen} and Ahmed Sharif and Latir Ali",

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Gain, AK, Chan, YC, Yung, KC, Sharif, A & Ali, L 2008, Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages. in Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC., 4684540, pp. 1291-1294, 2008 2nd Electronics Systemintegration Technology Conference, ESTC, Greenwich, United Kingdom, 1/09/08. https://doi.org/10.1109/ESTC.2008.4684540

Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages. / Gain, Asit Kumar; Chan, Y. C.; Yung, Kam Chuen et al.
Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. 2008. p. 1291-1294 4684540.

Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review

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AU - Chan, Y. C.

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AU - Sharif, Ahmed

AU - Ali, Latir

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AB - The effect of nano Ni additions in Sn-9Zn and Sn-8Zn-3Bi solders on their interfacial microstructures and shear strengths with Au/Ni/Cu pad metallization in ball grid array (BGA) applications were investigated. After addition ofnano Ni powder in Sn-based lead-free solders, there was no significant changes in the interfacial microstructure. But, in the solder region a very fine Zn phase was observed. Also, on the fracture surfaces fine Zn-Ni compound was found. After addition of nano Ni powder in Sn-based solders, the shear loads were increased and in addition, ductile fracture surfaces were clearly observed. The shear loads of Sn-9Zn and Sn-8Zn3-Bi solder were about 1798 gm and 2059 gm, respectively. After addition of nano Ni powder, their strengths were about 2172 gm and 2212 gm, respectively.

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Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

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