Effect of nano Ni additions on the structure and properties of Sn-9Zn and Sn-8Sn-3Bi solder in ball grid array packages

A.K. Gain, Y.C. Chan, Kam Chuen Yung

Research output: Unpublished conference presentation (presented paper, abstract, poster)Conference presentation (not published in journal/proceeding/book)Academic researchpeer-review

Original languageEnglish
Pages1291-1294
Number of pages4
Publication statusPublished - 2008
EventElectronics System-Integration Technology Conference [ESTC] -
Duration: 1 Jan 2008 → …

Conference

ConferenceElectronics System-Integration Technology Conference [ESTC]
Period1/01/08 → …

Cite this