Abstract
A polyvinylidene fluoride (PVDF) piezosensor was installed as an integral part of an ultrasonic wire-bonding transducer for measuring bonding parameters, such as impact force, ultrasonic amplitude, and bond time. Four different types of electrode patterns were used to optimize the sensor outputs. When the ring-shaped electrode of the sensor was subdivided into four different sections, namely the top, bottom, left, and right sections, different output signals were observed during the wire-bonding process. The top section of the sensor was more sensitive to the impact force while the left and right sections could track the changes in the ultrasonic amplitude proficiently. This sensor has good potential to be used in an in situ automatic wire-bonding process-control system.
| Original language | English |
|---|---|
| Pages (from-to) | 121-126 |
| Number of pages | 6 |
| Journal | Materials Science and Engineering B: Solid-State Materials for Advanced Technology |
| Volume | 99 |
| Issue number | 1-3 |
| DOIs | |
| Publication status | Published - 25 May 2003 |
| Event | Advanced Electronic-ceramic Materials. Proceedings of the 8th IUMRS-ICEM 2002 - Xi'an, China Duration: 10 Jun 2002 → 14 Jun 2002 |
Keywords
- Bonding quality monitoring
- Piezoelectric sensors
- Process control
- Ultrasonic wire bonding
ASJC Scopus subject areas
- General Materials Science
- Condensed Matter Physics
- Mechanics of Materials
- Mechanical Engineering