Effect of deposition conditions on internal stresses and microstructure of reactively sputtered tungsten nitride films

Keyphrases

• X-ray Photoelectron Spectroscopy 100%
• Sputtering Gas 100%
• Internal Stress 100%
• Gas Pressure 100%
• Deposition Conditions 100%
• Internal Microstructure 100%
• Tungsten Nitride 100%
• Nitride Films 100%
• Microstructure 50%
• Structural Properties 50%
• In Situ 50%
• Stoichiometry 50%
• Annealing 50%
• Cross-sectional Transmission Electron Microscopy 50%
• Transmission Electron Microscopy 50%
• High-resolution Electron Energy Loss Spectroscopy (HREELS) 50%
• Bonding Character 50%
• Amorphous Phase 50%
• Gas Mixture 50%
• As-deposited Films 50%
• Electron Microscopy Studies 50%
• Nitrogen Incorporation 50%
• Thick Film 50%
• Crystallization 50%
• Single-phase Structure 50%
• Microstructural Characteristics 50%
• Deposited Film 50%
• Nitrogen Partial Pressure 50%
• Curvature Measurement 50%
• Nitrogen Concentration 50%
• In Situ X-ray Diffraction 50%
• N2 Gas 50%
• Stress Generation 50%
• Substrate Curvature 50%
• Density Feature 50%
• Ionic Bond 50%
• Phase Forming 50%
• Two-phase Structure 50%
• Bonding Feature 50%

Material Science

• Tungsten 100%
• Nitride Compound 100%
• Film 100%
• Phase Structure 33%
• Transmission Electron Microscopy 33%
• X-Ray Photoelectron Spectroscopy 33%
• Electron Energy Loss Spectrometry 16%
• Structural Property 16%
• X-Ray Diffraction 16%
• Density 16%
• Ionic Bonding 16%
• Thin Films 16%
• Thick Films 16%
• Gas Mixture 16%