Effect of Cu stud microstructure and electroplating process on intermetallic compounds growth and reliability of flip-chip solder bump

Guo Wei Xiao, Philip Ching Ho Chan, Annette Teng, Jian Cai, Matthew M.F. Yuen

Research output: Journal article publicationJournal articleAcademic researchpeer-review

25 Citations (Scopus)

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Engineering