Effect of Cu stud microstructure and electroplating process on intermetallic compounds growth and reliability of flip-chip solder bump

Guo Wei Xiao, Philip Ching Ho Chan, Annette Teng, Jian Cai, Matthew M.F. Yuen

Research output: Journal article publication › Journal article › Academic research › peer-review

25 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Effect of Cu stud microstructure and electroplating process on intermetallic compounds growth and reliability of flip-chip solder bump'. Together they form a unique fingerprint.

Material Science