Keyphrases
Microstructure
100%
Intermetallic Compound Formation
100%
Electroplating Process
100%
Solder Bump
100%
Flip chip
100%
Stud
100%
Solder Joint
66%
Cu-Sn Intermetallic Compounds
66%
Surface Roughness
50%
Intermetallic Compound Layer
50%
Soldering
33%
Electroplating
16%
Activation Energy
16%
Grain Size
16%
Current Density
16%
Layer Thickness
16%
Shear Strength
16%
Failure Mode
16%
Arrhenius Equation
16%
Growth Rate
16%
Surface Microstructure
16%
Surface Structure
16%
Thermal Aging
16%
Deposition Process
16%
Flip-chip Technology
16%
Aging Test
16%
Reaction Layer Thickness
16%
Cu Microstructure
16%
Grain Surface
16%
Temperature-humidity Test
16%
Thermal Aging Test
16%
Cu Electroplating
16%
Electroplating Current
16%
Growth Kinetics
16%
Cu3Sn
16%
Microstructural Morphology
16%
Thermal Heat
16%
Engineering
Solder Bump
100%
Intermetallics
100%
Joints (Structural Components)
66%
Compound Layer
50%
Layer Thickness
33%
Growth Kinetics
16%
Critical Role
16%
Structure Surface
16%
Compound Formation
16%
Humidity Test
16%
Arrhenius Equation
16%
Failure Mode
16%
Activation Energy
16%
Deposition Process
16%
Shear Strength
16%
Material Science
Electroplating
100%
Intermetallics
100%
Solder Joint
66%
Surface Roughness
50%
Thermal Aging
33%
Grain Size
16%
Shear Strength
16%
Density
16%
Activation Energy
16%
Surface Structure
16%