Effect of copper oxide on the adhesion behavior of epoxy molding compound-copper interface
- Paular W.K. Chung
- , Matthew M.F. Yuen
- , Philip Ching Ho Chan
- , Nick K.C. Ho
- , David C.C. Lam
Research output: Chapter in book / Conference proceeding › Conference article published in proceeding or book › Academic research › peer-review
21
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(Scopus)