Keyphrases
Printed Circuit Board
100%
Epoxy
100%
Brominated Epoxy Resin
100%
Mechanical Properties
33%
Thermal Properties
33%
Composite Materials
33%
Thermal Conductivity Measurement
33%
Epoxy Matrix
33%
Uniaxial Tensile Test
33%
Electrical Properties
33%
Polymer-matrix Composites
33%
Strong Interaction
33%
Filler Content
33%
Tensile Strain
33%
Material Type
33%
Composite Properties
33%
Material System
33%
Maximum Tensile Strength
33%
Brominated
33%
Measurement Properties
33%
Dielectric Properties Measurement
33%
AlN Particles
33%
Damping Capacity
33%
Engineering
Printed Circuit Board Substrate
100%
Differential Mobility Analyzer
100%
Material System
50%
Printed Circuit Board
50%
Conductivity Measurement
50%
Damping Capacity
50%
Strong Interaction
50%
Epoxy Matrix
50%
Filler Content
50%
Dielectrics
50%
Ultimate Tensile Strength
50%
Thermal Conductivity
50%
Tensile Test
50%
Reinforced Plastic
50%
Composite Material
50%
Material Science
Epoxy
100%
Aluminum Nitride
100%
Electronic Circuit
100%
Composite Material
57%
Thermal Conductivity
14%
Dielectric Property
14%
Composite Material
14%
Ultimate Tensile Strength
14%
Thermal Property
14%
Reinforced Plastic
14%