Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads

S. K. Das, A. Sharif, Y. C. Chan, N. B. Wong, Kam Chuen Yung

Research output: Journal article publicationJournal articleAcademic researchpeer-review

25 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads'. Together they form a unique fingerprint.

Keyphrases

Engineering

Material Science