Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads
- S. K. Das
- , A. Sharif
- , Y. C. Chan
- , N. B. Wong
- , Kam Chuen Yung
Research output: Journal article publication › Journal article › Academic research › peer-review
26
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