Effect of Ag micro-particles content on the mechanical strength of the interface formed between Sn-Zn binary solder and Au/Ni/Cu bond pads

S. K. Das, A. Sharif, Y. C. Chan, N. B. Wong, Kam Chuen Yung

Research output: Journal article publication › Journal article › Academic research › peer-review

25 Citations (Scopus)

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Chemistry

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Physics