Abstract
Nano-sized, nonreacting, noncoarsening ZrO2particles reinforced Sn-3.0 wt%Ag-0.5 wt%Cu composite solders were prepared by mechanically dispersing ZrO2nano-particles into Sn-Ag-Cu solder. The interfacial morphology of unreinforced Sn-Ag-Cu solder and solder joints containing ZrO2nano-particles with Au/Ni metallized Cu pads on ball grid array (BGA) substrates and the distribution of reinforcing particles were characterized metallographically. At their interfaces, a Sn-Ni-Cu intermetallic compound (IMC) layer was found in both unreinforced Sn-Ag-Cu and Sn-Ag-Cu solder joints containing ZrO2nano-particles and the IMC layer thickness increased with the number of reflow cycles. In the solder ball region, AuSn4, Ag3Sn, Cu6Sn5IMC particles and ZrO2nano-particles were found to be uniformly distributed in the β-Sn matrix of Sn-Ag-Cu solder joints containing ZrO2nano-particles, which resulted in an increase in the shear strength, due to a second phase dispersion strengthening mechanism. The fracture surface of unreinforced Sn-Ag-Cu solder joints exhibited a brittle fracture mode with a smooth surface while Sn-Ag-Cu solder joints containing ZrO2nano-particles ductile failure characteristics with rough dimpled surfaces.
| Original language | English |
|---|---|
| Pages (from-to) | 2306-2313 |
| Number of pages | 8 |
| Journal | Microelectronics Reliability |
| Volume | 51 |
| Issue number | 12 |
| DOIs | |
| Publication status | Published - 1 Dec 2011 |
ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Electronic, Optical and Magnetic Materials
- Surfaces, Coatings and Films
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Safety, Risk, Reliability and Quality