Effct of spray-based printing parameters on cementitious material distribution

Bing Lu, Mingyang Li, Wenxin Lao, Yiwei Weng, Shunzhi Qian, Ming Jen Tan, Kah Fai Leong

Research output: Unpublished conference presentation (presented paper, abstract, poster)Conference presentation (not published in journal/proceeding/book)Academic researchpeer-review

5 Citations (Scopus)

Abstract

In the past decade, 3D printing is getting into more and more industry areas including building and construction. However, most 3D cementitious material printing processes are limited in horizontal printing surface. Due to the nature of building and construction industry, 3D spray cementitious material printing process was developed to apply material in vertical or even overhang surfaces. Unlike traditional manually operated spray method in building and construction industry, 3D spray cementitious material printing process requires higher accuracy on material distribution. In this paper, the effects of four printing parameters (cementitious material flow rate, air flow rate, nozzle travel speed, nozzle standoff distance) on material distribution in 3D spray cementitious material printing process were investigated experimentally. An experimental model, which can be further used in the control of 3D spray cementitious material printing process, was then developed upon on the results.

Original languageEnglish
Pages1989-2002
Number of pages14
Publication statusPublished - 2020
Event29th Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2018 - Austin, United States
Duration: 13 Aug 201815 Aug 2018

Conference

Conference29th Annual International Solid Freeform Fabrication Symposium - An Additive Manufacturing Conference, SFF 2018
Country/TerritoryUnited States
CityAustin
Period13/08/1815/08/18

Keywords

  • 3D cementitious material printing
  • Additive manufacturing
  • Material distribution
  • Modelling
  • Spray

ASJC Scopus subject areas

  • Surfaces, Coatings and Films
  • Surfaces and Interfaces

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